Qualcomm has been in the news due to the latest addition to its list of chipsets, Snapdragon 898, a successor of the Qualcomm Snapdragon 888. After jumping ships from Snapdragon 865 to Snapdragon 888, the new flagship chip Qualcomm Snapdragon 898 will be setting its foot in the market later in December this year.
The benchmark tests run over the 4nm chip, Qualcomm Snapdragon 898, show a 20% uplift in terms of its performance as compared to its predecessor. It has the strength to surpass 1 million AnTuTu points. The Snapdragon 898 might match up to the Apple A14 Bionic in terms of graphic performance. TSMC along with Samsung is taking point in the production of Snapdragon 898 with its 4nm nodes instead of the 5nm nodes.
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Qualcomm Snapdragon 898 Specifications
If leaks are to be believed, the chipset will hold a different CPU cluster than the Snapdragon 888: a 1 + 3 + 2 + 2, which means 1 x Cortex-X2 prime core, 3 x Cortex-A710 cores, 2 x Cortex-A510 cores, and 2 x Cortex-A510 cores. The cores’ clock speeds are 3.09 GHz for Cortex-X2, 2.8 GHz for the Cortex-A710 cores, 2.5 GHz and 1.8 GHz for the two Cortex A510 core pairs.
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The upcoming Qualcomm Snapdragon 898 chipset with improvements like Near Field Communication (NFC), Wi-Fi 6E, Bluetooth 5.2, and the much-awaited 5G speed, though racking up the performance, sucks up 6W of power (TDP), leading to a peak in temperature. This has put the chipset maker in a poor heat dissipation league, giving way for a cooling component market in the domain. This particular bad thermal characteristic will be shared by Exynos 2200 alongside the 898 chipset.
Brands like Sony, Xiaomi, Vivo, Oppo and Asus are likely to launch their new smartphone devices powered by the upcoming Qualcomm Snapdragon 898 chipset early next year.
Also read: Galaxy S20 FE 5G With Snapdragon 865 May Launch in India Next Week
